Ansys Icepak

Cooling Simulation Software for Electronic Components

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Revolutionizing Thermal Management in Electronics with CAD-centric Multiphysics Solutions

Predict airflow, temperature and heat transfer for electronics assemblies and printed circuit boards. With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products.

  • Unstructured, body-fitted meshing.
  • Comprehensive thermal reliability solution.
  • High-fidelity CFD solver.
  • Industry leading multiscale multiphysics.
  • Thermal Dynamic management

What are the benefits of Ansys Icepak?

How-to Videos

Unlocking Innovation: Ansys Icepak video series - your gateway to comprehensive Thermal Management Solutions.