Predict airflow, temperature and heat transfer for electronics assemblies and printed circuit boards. With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products. The solution’s high degree of accuracy results from the highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application.